Easybond is a temporary bonding layer for Mechanical Lift-Off (MLO) of solution-cast polymer films on carrier substrates.

EASY TO INTEGRATE

Easybond can be applied without complicated substrate preparation to provide a robust de-bonding process that is more tolerant to process fluctuations. Panel makers can achieve cost savings realized by eliminating LLO upkeep costs

 

DESIGNED FOR PYLUX AND POLYIMIDE SOLUTION-CAST FILMS

Provides a high surface energy for improved wettability and is compatible with high-temperature processing in excess of 500°C. Mechanical peel of the display module can be done with forces below < 5cN/cm

 

Replacing expensive equipment, cumbersome, low-yielding lasers, and complicated carrier preparation… Ares’ Easybond is the innovative solution for your temporary bonding needs. Want proof? Have a look a look at our video or find out how you can try it yourself!

“Easybond is an elegant, creative solution to the stubborn and expensive industry problem that releasing plastic-based display modules has become. Easybond brings operational simplicity, reduces the capital expense of costly equipment, and generates immediate profitability through a reduction of late-stage defects ”

David E. Arreaga
CEO of Ares Materials

Want to learn more? Contact us!